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College of Engineering
ECE Dept.
Clean Room
Facilities
Main
Facilities
Map
Deionized Water System
G
as Distribution System
Wet Benches
Oxidation/Diffusion Furnaces
Nanospec AFT 200
Photolithography I
Photolithography II
Inspection Station I
Inspection Station II
Reactive Ion Etch (RIE)
RIE with Oxygen Plasma
RIE Support
Plasma Etch/Deposition Tool
Varian Vacuum Thin Film System
CHA Vac
uum Thin Film System
CVC Sputter Coat Chamber
Cooke Thermal Evaporator
A
lphaStep Profilometer
Micromanipulator Probe Station
Microautomation Wafer Dicing Saw
West Bond Thermo-sonic Gold Wire Bonder
SPI Sputter Coater
MBE System for II-IV Materials
LPPE-CVD System
LPCVD High Temperature
Filmetrics Thin Film Analyzer F20
Trion Orion III PECVD Tool
Guidelines
Procedures Information
ENGR 1202
Quantum Device Advanced Microelectronics Material Laboratory
Manager
Cameron Hall
ECE Class 1000 Microelectronics Clean Room Facilities
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College of Engineering
