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Class 1000 Microelectronics Fabrication Clean Room |
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Department of Electrical and Computer
Engineering |
Cameron Hall 201
The University of North Carolina at Charlotte
William States Lee College of Engineering
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The microelectronics fabrication laboratory has 3000 square
feet of class 1000 clean room space.
This laboratory includes all of the necessary
facilities to fabricate complex devices and integrated
circuits. A
recirculating deionized water system supplies the lab with
high purity water.
Purge and process gases are plumbed throughout the
lab. Complete chemical cleaning and etching capabilities are
included. |
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The fabrication laboratory includes 8 high
temperature furnaces manufactured by Corso-Gray, Thermco,
and Lindberg.
These furnaces are used for high purity silicon oxidations,
n and p type doping and diffusion, and high temperature
anneals.
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The lab has complete photolithography capability including
wafer spin coating, direct contact mask exposure with a HTG
contact mask aligner, and developing facilities.
Etching is accomplished with either wet chemical
etching or plasma techniques using a Technics Micro-Plasma
series 900 plasma system, Texas Instruments A-24-D PECVD
tool, or an IBM designed reactive ion etch tool.
Metal thin films can be vacuum deposited with a Cooke
thermal evaporator, Cooke e-beam evaporator, Varian 3125 4
pocket e-beam evaporator, a CHA Mark 50 RF induction
evaporator, or a CVC AST-601 3 target sputtering tool.
The lab includes various inspection microscopes and
measurement tools including a Nanometrics Nanopsec AFT 200
automatic thickness tool, Tencor Alpha Step 200 surface
profiler, and a Dektak IIA surface profiler.
A K&S 4125 gold wire ball bonder is also available.
A Micromanipulator probe station with Tektronix 576
curve tracer is available for electrical measurements. |
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Four MBE (molecular beam epitaxy) systems are used for
advanced materials research.
The MBE systems are pumped be either cryogenic or
turbomolecular high vacuum pumps and have various deposition
sources for individual or co-deposition operations.
III-V and II-IV materials are currently under
investigation. |
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A SEM (scanning electron microscopes), two TEM (transmission
electron microscope), an AFM (atomic force microscope), and
a Raman spectrometer are available for advanced analysis. |
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College of Engineering
